DMF equipment

Tool List

 

Tool
 Name 		ManufacturerModelFunction
ASMLASMLPAS5500/100i-line stepper; 0.5 um resolution
DWL66+HeidelbergDWL66+auto-loading 6-inch wafers or 6 inch square reticles
light source: 375 nm
writing head resolution: 1 um
PicotrackPicotrackPCT-150CRS 2T-C-DCoating photoresists and developing imaged wafers with baking stations
 
SRDShellback820 dual stackSpin, Rinse and Drying 6 inch wafers or 6 in square reticles
COAT2JSTST0358A0Coating Photoresist SPR660 coating and hot plates
AWB3JSTST0357A0Developing imaged wafers
SISKJLCCMS-183 DC sputtering guns (Nb and Al); Rf clean up to 100W
TESKJLCCMS-183 DC sputtering guns (AlMn); Rf clean up to 100W
RNKJLCCMS-184 DC sputtering guns (PdAu, Nb and Ti); Rf clean up to 100W
PlassysPlassysMEB700S2I-UHV E-Beam evaporator 10kW; Ion milling; Ozone clean 
PVD200KJLCPVD200E-Beam evaporator, 10kW; Rf clean up to 300 W
Ox-CVDOxford"PlasmaPro 100/
ICPCVD"		Dielectric deposition tool
Ox-MTLOxfordPlasmaPro 100/
Cobra 300		Metal etcher
Ox-OxOxfordPlasmaPro 100/
Cobra 300		Dielectric etcher
RapierSPTS/KLARapierDeep silicon etcher
AWB1JST HF etch; BOE
AWB2JST Al etchant
AWB3JST Developing imaged wafers; MF26-A
SWB1JST Remove photoresist; Acetone, IPA, Methanol
SWB2JST Lift-off process; PG-remover, Acetone, IPA
SWB3JST MEMS releasing; PG-remover, Acetone, IPA
COAT2JST Coating photoresist; SPR 660, HMDS
KspaceKspaceUltraScanMeasuring film stress at room temperature
WollamWollamRC2-DIMeasuring dielectric films
F54-UVFilmetricsF54-UVMeasuring known index dielectric films
P-17KLAP-17Stylus profilometer
S12KFormFactorSummit 12KSemi-auto wafer probe station
R50KLAR50-200-4PP Sheet Resistance Measurement System.
VK-X3000KeyenceVK-X3000Optical profiler; film thickness measurement
MS1LeicaDM8000microscope with manual stage
MS2LeicaDM8000microscope with auto-stage
MS3LeicaDM8000microscope with auo-stage, UV and software package
Lynx EvoVision Engineering IncLynx EvoDigital stereoscope